Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847471 | Dielectric filler material in conductive material that functions as fiducial for an electronic device | Jesse C. Jones, Gang Duan, Jason M. Gamba, Yosuke Kanaoka, Vishal Shajan | 2020-11-24 |
| 10777428 | Via interconnects in substrate packages | Srinivas V. Pietambaram | 2020-09-15 |
| 10741534 | Multi-die microelectronic device with integral heat spreader | Aleksandar Aleksov, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Robert Alan May, Srinivas V. Pietambaram | 2020-08-11 |
| 10705293 | Substrate integrated waveguide | Robert Alan May, Kristof Darmawikarta, Rahul Jain, Sri Ranga Sai Boyapati, Maroun D. Moussallem +1 more | 2020-07-07 |
| 10672695 | Multi-layer molded substrate with graded CTE | Srinivas V. Pietambaram | 2020-06-02 |
| 10658281 | Integrated circuit substrate and method of making | Kousik Ganesan, Marcel Wall, Srinivas V. Pietambaram | 2020-05-19 |