Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872872 | Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling | Robert Alan May, Kristof Darmawikarta, Srinivas V. Pietambaram, Javier Soto Gonzalez, Kwangmo Chris Lim +1 more | 2020-12-22 |
| 10856424 | Electronic assembly that includes void free holes | Amanda E. Schuckman, Sashi S. Kandanur, Srinivas V. Pietambaram, Mark S. Hlad, Kristof Darmawikarta | 2020-12-01 |
| 10854541 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more | 2020-12-01 |
| 10790233 | Package substrates with integral devices | Robert Alan May, Kristof Darmawikarta | 2020-09-29 |
| 10741534 | Multi-die microelectronic device with integral heat spreader | Aleksandar Aleksov, Kristof Darmawikarta, Rahul N. Manepalli, Robert Alan May, Srinivas V. Pietambaram | 2020-08-11 |
| 10727185 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Adel A. Elsherbini, Kristof Darmawikarta, Robert Alan May | 2020-07-28 |
| 10707168 | Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Robert Alan May, Islam A. Salama, Robert L. Sankman | 2020-07-07 |
| 10705293 | Substrate integrated waveguide | Robert Alan May, Kristof Darmawikarta, Rahul Jain, Maroun D. Moussallem, Rahul N. Manepalli +1 more | 2020-07-07 |
| 10692847 | Inorganic interposer for multi-chip packaging | Daniel N. Sobieski, Kristof Darmawikarta, Merve Celikkol, Kyu Oh Lee, Kemal Aygun +1 more | 2020-06-23 |