Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10707168 | Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Robert L. Sankman | 2020-07-07 |
| 10553453 | Systems and methods for semiconductor packages using photoimageable layers | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Amanda E. Schuckman, Amruthavalli P. Alur, Yikang Deng +1 more | 2020-02-04 |