Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741947 | Plated through hole socketing coupled to a solder ball to engage with a pin | Amruthavalli Pallavi Alur, Liwei Cheng, Lauren A. Link, Jonathan L. Rosch, Sai Vadlamani +1 more | 2020-08-11 |
| 10727184 | Microelectronic device including non-homogeneous build-up dielectric | Srinivas V. Pietambaram | 2020-07-28 |
| 10685850 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Lilia May, Amanda E. Schuckman | 2020-06-16 |
| 10553453 | Systems and methods for semiconductor packages using photoimageable layers | Sri Chaitra Jyotsna Chavali, Amanda E. Schuckman, Amruthavalli P. Alur, Islam A. Salama, Yikang Deng +1 more | 2020-02-04 |