| 10867926 |
High density interconnect structures configured for manufacturing and performance |
Henning Braunisch, Ajay Jain, Zhiguo Qian |
2020-12-15 |
| 10854539 |
Ground via clustering for crosstalk mitigation |
Zhiguo Qian, Yu Zhang |
2020-12-01 |
| 10833020 |
High density interconnect structures configured for manufacturing and performance |
Henning Braunisch, Ajay Jain, Zhiguo Qian |
2020-11-10 |
| 10804650 |
Electrical connector having offset contacts for minimizing or cancelling crosstalk |
Jeffrey Lee, Brent R. Rothermel |
2020-10-13 |
| 10784204 |
Rlink—die to die channel interconnect configurations to improve signaling |
Richard J. Dischler, Jeff C. Morriss, Zhiguo Qian, Wilfred Gomes, Yu Zhang +7 more |
2020-09-22 |
| 10748842 |
Package substrates with magnetic build-up layers |
Zhiguo Qian, Kaladhar Radhakrishnan |
2020-08-18 |
| 10716231 |
Pin count socket having reduced pin count and pattern transformation |
Srikant Nekkanty, Zhichao Zhang |
2020-07-14 |
| 10692847 |
Inorganic interposer for multi-chip packaging |
Daniel N. Sobieski, Kristof Darmawikarta, Sri Ranga Sai Boyapati, Merve Celikkol, Kyu Oh Lee +1 more |
2020-06-23 |
| 10607951 |
Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices |
Yu Zhang, Gabriel Regalado Silva, Zhiguo Qian |
2020-03-31 |
| 10580734 |
Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices |
Yu Zhang, Gabriel Regalado Silva, Zhiguo Qian |
2020-03-03 |