Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867926 | High density interconnect structures configured for manufacturing and performance | Henning Braunisch, Kemal Aygun, Zhiguo Qian | 2020-12-15 |
| 10833020 | High density interconnect structures configured for manufacturing and performance | Henning Braunisch, Kemal Aygun, Zhiguo Qian | 2020-11-10 |
| 10797014 | Rounded metal trace corner for stress reduction | Dae-Woo Kim, Neha M. Patel, Rodrick J. Hendricks, Sujit Sharan | 2020-10-06 |
| 10652189 | Message encoding and transmission across multiple platforms | Carrick John Pierce, Baris Mestanogullari, Agnes Casenave, David Bernard Barton, Nicholas Bandy | 2020-05-12 |