Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797014 | Rounded metal trace corner for stress reduction | Dae-Woo Kim, Ajay Jain, Neha M. Patel, Rodrick J. Hendricks | 2020-10-06 |
| 10763216 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz +1 more | 2020-09-01 |
| 10651117 | Low-inductance current paths for on-package power distributions and methods of assembling same | Andrew Collins, Jianyong Xie | 2020-05-12 |