Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847467 | Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same | Andrew Collins, Debendra Mallik, Mathew J. Manusharow | 2020-11-24 |
| 10651117 | Low-inductance current paths for on-package power distributions and methods of assembling same | Andrew Collins, Sujit Sharan | 2020-05-12 |