Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10847467 | Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same | Andrew Collins, Mathew J. Manusharow, Jianyong Xie | 2020-11-24 | $25,522,000 |
| 10796988 | Localized high density substrate routing | Robert Starkston, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2020-10-06 | $29,609,000 |
| 10741419 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita | 2020-08-11 | $37,011,000 |
| 10658765 | Edge-firing antenna walls built into substrate | Sri Chaitra Jyotsna Chavali, Sanka Ganesan, William J. Lambert, Zhichao Zhang | 2020-05-19 | $31,576,000 |
| 10636716 | Through-mold structures | Sasha N. Oster, Srikant Nekkanty, Joshua D. Heppner, Adel A. Elsherbini, Yoshihiro Tomita +2 more | 2020-04-28 | $36,717,000 |