Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10796988 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2020-10-06 |
| 10651051 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | Robert L. Sankman | 2020-05-12 |
| 10636769 | Semiconductor package having spacer layer | Weng Hong Teh, Shan Zhong | 2020-04-28 |
| 10595409 | Electro-magnetic interference (EMI) shielding techniques and configurations | Adel A. Elsherbini, Ravindranath V. Mahajan, Nitin A. Deshpande | 2020-03-17 |
| 10541232 | Recessed and embedded die coreless package | — | 2020-01-21 |