Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861815 | High density substrate routing in package | Chia-Pin Chiu | 2020-12-08 |
| 10636722 | System and method to enhance solder joint reliability | Lee Kong Yu, Sungjun Im, Chun Sean Lau, Yoong Tatt Chin, Paramjeet Singh Gill | 2020-04-28 |
| 10636769 | Semiconductor package having spacer layer | John S. Guzek, Shan Zhong | 2020-04-28 |