Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10636722 | System and method to enhance solder joint reliability | Lee Kong Yu, Sungjun Im, Chun Sean Lau, Paramjeet Singh Gill, Weng Hong Teh | 2020-04-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10636722 | System and method to enhance solder joint reliability | Lee Kong Yu, Sungjun Im, Chun Sean Lau, Paramjeet Singh Gill, Weng Hong Teh | 2020-04-28 |