Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784204 | Rlink—die to die channel interconnect configurations to improve signaling | Kemal Aygun, Richard J. Dischler, Jeff C. Morriss, Zhiguo Qian, Wilfred Gomes +7 more | 2020-09-22 |
| 10672693 | Integrated circuit structures in package substrates | William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael J. Hill +1 more | 2020-06-02 |
| 10658279 | High density package interconnects | Zhiguo Qian, Robert L. Sankman, Krishna Srinivasan, Zhaohui Zhu | 2020-05-19 |
| 10658765 | Edge-firing antenna walls built into substrate | Sri Chaitra Jyotsna Chavali, William J. Lambert, Debendra Mallik, Zhichao Zhang | 2020-05-19 |
| 10651116 | Planar integrated circuit package interconnects | Robert L. Sankman | 2020-05-12 |
| 10580758 | Scalable package architecture and associated techniques and configurations | Bassam M. Ziadeh, Nitesh Nimkar | 2020-03-03 |