Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741419 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Yoshihiro Tomita | 2020-08-11 |
| 10681851 | Pick and place tooling with adjustable nozzle configuration | Alin Ila, Nathan P. Heckathorne | 2020-06-09 |
| 10580758 | Scalable package architecture and associated techniques and configurations | Sanka Ganesan, Nitesh Nimkar | 2020-03-03 |
| 10529600 | Decoupling systems | Nathan P. Heckathorne, Douglas Heymann | 2020-01-07 |