Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10789201 | High performance interconnect | Zuoguo Wu, Debendra Das Sharma, Mohiuddin M. Mazumder, Jong-Ru Guo, Anupriya Sriramulu +2 more | 2020-09-29 |
| 10784204 | Rlink—die to die channel interconnect configurations to improve signaling | Kemal Aygun, Richard J. Dischler, Zhiguo Qian, Wilfred Gomes, Yu Zhang +7 more | 2020-09-22 |
| 10678736 | Extending multichip package link off package | Debendra Das Sharma, Zuoguo Wu, Mahesh Wagh, Mohiuddin M. Mazumder, Venkatraman Iyer | 2020-06-09 |