Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10789201 | High performance interconnect | Zuoguo Wu, Debendra Das Sharma, Jong-Ru Guo, Anupriya Sriramulu, Narasimha Lanka +2 more | 2020-09-29 |
| 10678736 | Extending multichip package link off package | Debendra Das Sharma, Zuoguo Wu, Mahesh Wagh, Venkatraman Iyer, Jeff C. Morriss | 2020-06-09 |