Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748842 | Package substrates with magnetic build-up layers | Zhiguo Qian, Kemal Aygun | 2020-08-18 |
| 10741536 | Magnetic small footprint inductor array module for on-package voltage regulator | Yongki Min, Reynaldo A. Olmedo, William J. Lambert, Leigh E. Wojewoda, Venkat Anil K. Magadala +1 more | 2020-08-11 |