Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872872 | Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling | Robert Alan May, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Javier Soto Gonzalez, Kwangmo Chris Lim +1 more | 2020-12-22 |
| 10856424 | Electronic assembly that includes void free holes | Sri Ranga Sai Boyapati, Amanda E. Schuckman, Sashi S. Kandanur, Srinivas V. Pietambaram, Mark S. Hlad | 2020-12-01 |
| 10854541 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more | 2020-12-01 |
| 10790233 | Package substrates with integral devices | Robert Alan May, Sri Ranga Sai Boyapati | 2020-09-29 |
| 10741534 | Multi-die microelectronic device with integral heat spreader | Aleksandar Aleksov, Sri Ranga Sai Boyapati, Rahul N. Manepalli, Robert Alan May, Srinivas V. Pietambaram | 2020-08-11 |
| 10727185 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Adel A. Elsherbini, Robert Alan May, Sri Ranga Sai Boyapati | 2020-07-28 |
| 10714434 | Integrated magnetic inductors for embedded-multi-die interconnect bridge substrates | Srinivas V. Pietambaram, Aleksandar Aleksov | 2020-07-14 |
| 10705293 | Substrate integrated waveguide | Robert Alan May, Rahul Jain, Sri Ranga Sai Boyapati, Maroun D. Moussallem, Rahul N. Manepalli +1 more | 2020-07-07 |
| 10692847 | Inorganic interposer for multi-chip packaging | Daniel N. Sobieski, Sri Ranga Sai Boyapati, Merve Celikkol, Kyu Oh Lee, Kemal Aygun +1 more | 2020-06-23 |
| 10553453 | Systems and methods for semiconductor packages using photoimageable layers | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Amanda E. Schuckman, Amruthavalli P. Alur, Islam A. Salama +1 more | 2020-02-04 |