Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872872 | Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Srinivas V. Pietambaram, Kwangmo Chris Lim +1 more | 2020-12-22 |
| 10798817 | Method for making a flexible wearable circuit | Aleksandar Aleksov, Meizi Jiao, Shruti R. Jaywant, Oscar Ojeda, Sashi S. Kandanur +4 more | 2020-10-06 |