Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784204 | Rlink—die to die channel interconnect configurations to improve signaling | Kemal Aygun, Richard J. Dischler, Jeff C. Morriss, Zhiguo Qian, Wilfred Gomes +7 more | 2020-09-22 |
| 10651525 | Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Aleksandar Aleksov +3 more | 2020-05-12 |