| 10868366 |
Package architecture for antenna arrays |
Adel A. Elsherbini, William J. Lambert |
2020-12-15 |
| 10852495 |
Microelectronic package communication using radio interfaces connected through wiring |
Adel A. Elsherbini, Telesphor Kamgaing, Sasha N. Oster, Gaurav Chawla |
2020-12-01 |
| 10845552 |
Coreless package architecture for multi-chip opto-electronics |
Henning Braunisch, Timothy A. Gosselin, Prasanna Raghavan, Yikang Deng, Zhiguo Qian |
2020-11-24 |
| 10840430 |
Piezoelectric package-integrated sensing devices |
Feras Eid, Sasha N. Oster, Georgios Dogiamis, Adel A. Elsherbini, Thomas L. Sounart +1 more |
2020-11-17 |
| 10820437 |
Flexible packaging for a wearable electronic device |
Aleksandar Aleksov, Son V. Nguyen, Rajat Goyal, David B. Lampner, Dilan Seneviratne +4 more |
2020-10-27 |
| 10816733 |
Piezoelectrically actuated mirrors for optical communications |
Sasha N. Oster, Johanna M. Swan, Feras Eid, Thomas L. Sounart, Aleksandar Aleksov +2 more |
2020-10-27 |
| 10790231 |
Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate |
Eric J. Li, Timothy A. Gosselin, Yoshihiro Tomita, Amram Eitan, Mark Saltas |
2020-09-29 |
| 10748844 |
Stress isolation for silicon photonic applications |
Siddarth Kumar |
2020-08-18 |
| 10734358 |
Multi-packaging for single-socketing |
Jonathan L. Rosch, Amruthavalli Pallavi Alur, Arun Chandrasekhar |
2020-08-04 |
| 10721568 |
Piezoelectric package-integrated acoustic transducer devices |
Georgios Dogiamis, Feras Eid, Adel A. Elsherbini, Johanna M. Swan, Thomas L. Sounart +1 more |
2020-07-21 |
| 10707171 |
Ultra small molded module integrated with die by module-on-wafer assembly |
Tomita YOSHIHIRO, Eric J. Li, Javier A. Falcon, Joshua D. Heppner |
2020-07-07 |
| 10658566 |
Piezoelectric driven switches integrated in organic, flexible displays |
Feras Eid, Aleksandar Aleksov, Sasha N. Oster, Baris Bicen, Thomas L. Sounart +3 more |
2020-05-19 |
| 10649158 |
Alignment of single and multi-mode optical fibers using piezoelectric actuators |
Johanna M. Swan, Aleksandar Aleksov, Sasha N. Oster, Feras Eid, Baris Bicen +2 more |
2020-05-12 |
| 10644616 |
Piezoelectric package-integrated motor |
Georgios Dogiamis, Sasha N. Oster, Feras Eid, Adel A. Elsherbini, Thomas L. Sounart +1 more |
2020-05-05 |
| 10634566 |
Piezoelectric package-integrated temperature sensing devices |
Feras Eid, Sasha N. Oster, Georgios Dogiamis, Thomas L. Sounart, Adel A. Elsherbini +1 more |
2020-04-28 |
| 10636716 |
Through-mold structures |
Sasha N. Oster, Srikant Nekkanty, Joshua D. Heppner, Adel A. Elsherbini, Yoshihiro Tomita +2 more |
2020-04-28 |
| 10629557 |
Improving mechanical and thermal reliability in varying form factors |
Veronica Strong, Sasha N. Oster |
2020-04-21 |
| 10594029 |
Actuatable and adaptable metamaterials integrated in package |
Adel A. Elsherbini, Sasha N. Oster, Feras Eid, Georgios Dogiamis, Thomas L. Sounart +1 more |
2020-03-17 |
| 10573608 |
Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package |
Georgios Dogiamis, Telesphor Kamgaing, Eric J. Li, Javier A. Falcon, Yoshihiro Tomita +1 more |
2020-02-25 |
| 10566672 |
Waveguide connector with tapered slot launcher |
Adel A. Elsherbini, Sasha N. Oster, Johanna M. Swan, Georgios Dogiamis, Aleksandar Aleksov +1 more |
2020-02-18 |