| 10868357 |
Massive antenna array architecture for base stations designed for high frequency communications |
Georgios Dogiamis, Sasha N. Oster |
2020-12-15 |
$39,832,000 |
| 10852495 |
Microelectronic package communication using radio interfaces connected through wiring |
Shawna M. Liff, Adel A. Elsherbini, Sasha N. Oster, Gaurav Chawla |
2020-12-01 |
$25,476,000 |
| 10847889 |
Patch antenna with isolated feeds |
Adewale K Oladeinde |
2020-11-24 |
$25,522,000 |
| 10819445 |
Waveguide and transceiver interference mitigation |
Georgios Dogiamis, Henning Braunisch, Hyung-Jin Lee, Richard J. Dischler |
2020-10-27 |
$34,955,000 |
| 10804227 |
Semiconductor packages with antennas |
Adel A. Elsherbini, Sasha N. Oster |
2020-10-13 |
$29,561,000 |
| 10777538 |
System on package architecture including structures on die back side |
Fay Hua, Johanna M. Swan |
2020-09-15 |
$34,212,000 |
| 10734236 |
Electronic devices with components formed by late binding using self-assembled monolayers |
Sasha N. Oster, Fay Hua, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan |
2020-08-04 |
$32,661,000 |
| 10734735 |
Distributed on-package millimeter-wave radio |
Adel A. Elsherbini |
2020-08-04 |
$32,661,000 |
| 10680788 |
Waveguide communication with increased link data rate |
Georgios Dogiamis, Emanuel Cohen, Sasha N. Oster |
2020-06-09 |
$37,008,000 |
| 10658312 |
Embedded millimeter-wave phased array module |
Adel A. Elsherbini, Valluri Rao |
2020-05-19 |
$31,576,000 |
| 10629551 |
Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric |
Georgios Dogiamis, Javier A. Falcon, Yoshihiro Tomita, Vijay K. Nair |
2020-04-21 |
$45,742,000 |
| 10623106 |
Orthogonal frequency division multiplexing single sideband transmission over a waveguide |
Hyung-Jin Lee, Cho-Ying Lu, Henning Braunisch, Georgios Dogiamis, Richard J. Dischler |
2020-04-14 |
$33,667,000 |
| 10615133 |
Die package with superposer substrate for passive components |
Valluri Rao |
2020-04-07 |
$35,530,000 |
| 10595410 |
Non-planar on-package via capacitor |
Fay Hua, Brandon M. Rawlings, Georgios Dogiamis |
2020-03-17 |
$21,927,000 |
| 10594294 |
Piezoelectric package-integrated delay lines |
Adel A. Elsherbini, Feras Eid, Baris Bicen, Vijay K. Nair, Georgios Dogiamis +2 more |
2020-03-17 |
$21,927,000 |
| 10593636 |
Platform with thermally stable wireless interconnects |
Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Brandon M. Rawlings, Feras Eid |
2020-03-17 |
$21,927,000 |
| 10573608 |
Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package |
Georgios Dogiamis, Eric J. Li, Javier A. Falcon, Yoshihiro Tomita, Vijay K. Nair +1 more |
2020-02-25 |
$18,813,000 |
| 10566672 |
Waveguide connector with tapered slot launcher |
Adel A. Elsherbini, Sasha N. Oster, Johanna M. Swan, Georgios Dogiamis, Shawna M. Liff +1 more |
2020-02-18 |
$23,634,000 |
| 10546835 |
Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric |
Vijay K. Nair, Georgios Dogiamis |
2020-01-28 |
$38,246,000 |
