Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10645813 | Zero-misalignment via-pad structures | Henning Braunisch | 2020-05-05 |
| 10593636 | Platform with thermally stable wireless interconnects | Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Feras Eid | 2020-03-17 |
| 10595410 | Non-planar on-package via capacitor | Fay Hua, Georgios Dogiamis, Telesphor Kamgaing | 2020-03-17 |