| 10868357 |
Massive antenna array architecture for base stations designed for high frequency communications |
Sasha N. Oster, Telesphor Kamgaing |
2020-12-15 |
| 10845380 |
Microelectronic devices for isolating drive and sense signals of sensing devices |
Feras Eid, Henning Braunisch, Sasha N. Oster |
2020-11-24 |
| 10840430 |
Piezoelectric package-integrated sensing devices |
Feras Eid, Sasha N. Oster, Shawna M. Liff, Adel A. Elsherbini, Thomas L. Sounart +1 more |
2020-11-17 |
| 10819445 |
Waveguide and transceiver interference mitigation |
Telesphor Kamgaing, Henning Braunisch, Hyung-Jin Lee, Richard J. Dischler |
2020-10-27 |
| 10721568 |
Piezoelectric package-integrated acoustic transducer devices |
Feras Eid, Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Thomas L. Sounart +1 more |
2020-07-21 |
| 10680788 |
Waveguide communication with increased link data rate |
Telesphor Kamgaing, Emanuel Cohen, Sasha N. Oster |
2020-06-09 |
| 10644616 |
Piezoelectric package-integrated motor |
Shawna M. Liff, Sasha N. Oster, Feras Eid, Adel A. Elsherbini, Thomas L. Sounart +1 more |
2020-05-05 |
| 10634566 |
Piezoelectric package-integrated temperature sensing devices |
Feras Eid, Sasha N. Oster, Thomas L. Sounart, Adel A. Elsherbini, Shawna M. Liff +1 more |
2020-04-28 |
| 10629551 |
Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric |
Telesphor Kamgaing, Javier A. Falcon, Yoshihiro Tomita, Vijay K. Nair |
2020-04-21 |
| 10623106 |
Orthogonal frequency division multiplexing single sideband transmission over a waveguide |
Hyung-Jin Lee, Cho-Ying Lu, Henning Braunisch, Telesphor Kamgaing, Richard J. Dischler |
2020-04-14 |
| 10595410 |
Non-planar on-package via capacitor |
Fay Hua, Brandon M. Rawlings, Telesphor Kamgaing |
2020-03-17 |
| 10594294 |
Piezoelectric package-integrated delay lines |
Adel A. Elsherbini, Feras Eid, Baris Bicen, Telesphor Kamgaing, Vijay K. Nair +2 more |
2020-03-17 |
| 10594029 |
Actuatable and adaptable metamaterials integrated in package |
Shawna M. Liff, Adel A. Elsherbini, Sasha N. Oster, Feras Eid, Thomas L. Sounart +1 more |
2020-03-17 |
| 10593636 |
Platform with thermally stable wireless interconnects |
Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Brandon M. Rawlings, Feras Eid |
2020-03-17 |
| 10573608 |
Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package |
Telesphor Kamgaing, Eric J. Li, Javier A. Falcon, Yoshihiro Tomita, Vijay K. Nair +1 more |
2020-02-25 |
| 10566672 |
Waveguide connector with tapered slot launcher |
Adel A. Elsherbini, Sasha N. Oster, Johanna M. Swan, Shawna M. Liff, Aleksandar Aleksov +1 more |
2020-02-18 |
| 10546835 |
Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric |
Vijay K. Nair, Telesphor Kamgaing |
2020-01-28 |