Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10756004 | Quantum computing assemblies with through-hole dies | Adel A. Elsherbini, David J. Michalak | 2020-08-25 |
| 10707171 | Ultra small molded module integrated with die by module-on-wafer assembly | Tomita YOSHIHIRO, Eric J. Li, Shawna M. Liff, Joshua D. Heppner | 2020-07-07 |
| 10629551 | Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric | Georgios Dogiamis, Telesphor Kamgaing, Yoshihiro Tomita, Vijay K. Nair | 2020-04-21 |
| 10573608 | Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package | Georgios Dogiamis, Telesphor Kamgaing, Eric J. Li, Yoshihiro Tomita, Vijay K. Nair +1 more | 2020-02-25 |