Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727114 | Interconnect structure including airgaps and substractively etched metal lines | Robert L. Bruce, Alfred Grill, Teddie Peregrino Magbitang, Hiroyuki Miyazoe, Deborah A. Neumayer | 2020-07-28 |
| 10727121 | Thin film interconnects with large grains | Robert L. Bruce, Cyril Cabral, Jr., Gregory M. Fritz, Michael F. Lofaro, Hiroyuki Miyazoe +2 more | 2020-07-28 |
| 10643859 | Hydrofluorocarbon gas-assisted plasma etch for interconnect fabrication | Robert L. Bruce, Joe Lee, Takefumi Suzuki | 2020-05-05 |
| 10607899 | Nano deposition and ablation for the repair and fabrication of integrated circuits | Shawn A. Adderly, Jeffrey P. Gambino, Anthony C. Speranza | 2020-03-31 |
| 10600656 | Directed self-assembly for copper patterning | Hiroyuki Miyazoe, Adam M. Pyzyna, HsinYu Tsai | 2020-03-24 |
| 10529633 | Method of integrated circuit (IC) chip fabrication | Sebastian U. Engelmann | 2020-01-07 |