Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727114 | Interconnect structure including airgaps and substractively etched metal lines | Robert L. Bruce, Eric A. Joseph, Teddie Peregrino Magbitang, Hiroyuki Miyazoe, Deborah A. Neumayer | 2020-07-28 |
| 10643890 | Ultrathin multilayer metal alloy liner for nano Cu interconnects | Daniel C. Edelstein, Seth L. Knupp, Son V. Nguyen, Takeshi Nogami, Vamsi K. Paruchuri +2 more | 2020-05-05 |