Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672626 | Method and materials for warpage thermal and interconnect solutions | Omkar G. Karhade, Nitin A. Deshpande, Aditya Sundoctor VAIDYA, Eric J. Li | 2020-06-02 |
| 10615128 | Systems and methods for electromagnetic interference shielding | Rajendra C. Dias, Anna M. Prakash, Joshua D. Heppner, Eric J. Li | 2020-04-07 |
| 10607909 | Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging | Purushotham Kaushik Muthur Srinath, Pramod Malatkar, Sairam Agraharam, Chandra Mohan Jha, Arnab Choudhury | 2020-03-31 |
| 10586779 | LPS solder paste based low cost fine pitch pop interconnect solutions | James C. Matayabas, Jr., Akshay Mathkar | 2020-03-10 |