Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10586779 | LPS solder paste based low cost fine pitch pop interconnect solutions | Nachiket R. Raravikar, Akshay Mathkar | 2020-03-10 |
| 10580717 | Multiple-chip package with multiple thermal interface materials | Boxi LIU, Hemanth K. Dhavaleswarapu, Syadwad Jain | 2020-03-03 |