Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763188 | Integrated heat spreader having electromagnetically-formed features | Aravindha R. Antoniswamy, Thomas J. Fitzgerald, Kumaran Murugesan Chakravarthy, Wei Hu, Zhizhong Tang | 2020-09-01 |
| 10651108 | Foam composite | Zhizhong Tang, Wei Hu, Michael A. Schroeder, Rajen S. Sidhu, Carl Deppisch +3 more | 2020-05-12 |
| 10580717 | Multiple-chip package with multiple thermal interface materials | Boxi LIU, Hemanth K. Dhavaleswarapu, James C. Matayabas, Jr. | 2020-03-03 |