Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10580717 | Multiple-chip package with multiple thermal interface materials | Hemanth K. Dhavaleswarapu, Syadwad Jain, James C. Matayabas, Jr. | 2020-03-03 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10580717 | Multiple-chip package with multiple thermal interface materials | Hemanth K. Dhavaleswarapu, Syadwad Jain, James C. Matayabas, Jr. | 2020-03-03 |