Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10700051 | Multi-chip packaging | Robert L. Sankman, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2020-06-30 |
| 10607909 | Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging | Purushotham Kaushik Muthur Srinath, Pramod Malatkar, Chandra Mohan Jha, Arnab Choudhury, Nachiket R. Raravikar | 2020-03-31 |