Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607909 | Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging | Pramod Malatkar, Sairam Agraharam, Chandra Mohan Jha, Arnab Choudhury, Nachiket R. Raravikar | 2020-03-31 |