Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607909 | Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging | Purushotham Kaushik Muthur Srinath, Pramod Malatkar, Sairam Agraharam, Arnab Choudhury, Nachiket R. Raravikar | 2020-03-31 |
| 10541190 | Stacked die package with through-mold thermally conductive structures between a bottom die and a thermally conductive material | Eric J. Li | 2020-01-21 |