Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784033 | Vertical inductor for WLCSP | Andreas Wolter, Gerhard Knoblinger | 2020-09-22 |
| 10777491 | Package comprising carrier with chip and component mounted via opening | Thorsten Scharf | 2020-09-15 |
| 10734352 | Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement | Irmgard Escher-Poeppel, Khalil Hosseini, Johannes Lodermeyer, Joachim Mahler, Georg Meyer-Berg +6 more | 2020-08-04 |
| 10707158 | Package with vertical interconnect between carrier and clip | Alexander Heinrich, Bernd Goller, Gerald Ofner | 2020-07-07 |
| 10700037 | Reinforcement for electrical connectors | Eung San Cho, Xaver Schloegel, Thomas Behrens, Josef Hoeglauer | 2020-06-30 |
| 10629575 | Stacked die semiconductor package with electrical interposer | Thorsten Scharf, Carsten Ahrens, Helmut Brech, Martin Gruber, Matthias Zigldrum | 2020-04-21 |
| 10625769 | Motor vehicle steering system, assembly tool and assembly method for a motor vehicle steering system | Axel Hebenstreit, Hans-Dieter Loeffler, Marco Schwieger | 2020-04-21 |
| 10566309 | Multi-purpose non-linear semiconductor package assembly line | Gerald Ofner, Peter Scherl, Stephan Bradl, Stefan Miethaner, Alexander Heinrich +1 more | 2020-02-18 |
| 10535634 | Multi-layer package | Vijay K. Nair, Chuan Hu | 2020-01-14 |