Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10793419 | MEMS assembly | Marc Fueldner, Niccoló De Milleri, Ulrich Krumbein, Gerhard Lohninger, Giordano Tosolini +1 more | 2020-10-06 |
| 10707158 | Package with vertical interconnect between carrier and clip | Alexander Heinrich, Thorsten Meyer, Gerald Ofner | 2020-07-07 |
| 10570007 | MEMS assembly and method for producing a MEMS assembly | Gunar Lorenz | 2020-02-25 |
| 10549985 | Semiconductor package with a through port for sensor applications | Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Thomas Kilger +5 more | 2020-02-04 |