Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861818 | Die stack arrangement comprising a die-attach-film tape and method for producing same | Karolina Gierl | 2020-12-08 |
| 10793429 | Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly | Christian Geissler, Karolina Zogal | 2020-10-06 |
| 10616703 | MEMS sound transducer element and method for producing a MEMS sound transducer element | Horst Theuss | 2020-04-07 |
| 10584028 | Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly | Christian Geissler, Karolina Zogal | 2020-03-10 |
| 10549985 | Semiconductor package with a through port for sensor applications | Dominic Maier, Chau Fatt Chiang, Christian Geissler, Bernd Goller, Thomas Kilger +5 more | 2020-02-04 |