Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10796981 | Chip to lead interconnect in encapsulant of molded semiconductor package | Khay Chwan Saw | 2020-10-06 |
| 10777536 | Semiconductor package with air cavity | April Coleen Tuazon Bernardez, Junny Abdul Wahid, Roslie Saini bin Bakar, Kon Hoe Chin, Hock Heng Chong +8 more | 2020-09-15 |
| 10639833 | Molding system with movable mold tool | Khar Foong Chung | 2020-05-05 |
| 10631100 | Micro-electrical mechanical system sensor package and method of manufacture thereof | Kok Yau Chua | 2020-04-21 |
| 10549985 | Semiconductor package with a through port for sensor applications | Dominic Maier, Matthias Steiert, Christian Geissler, Bernd Goller, Thomas Kilger +5 more | 2020-02-04 |