Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10796981 | Chip to lead interconnect in encapsulant of molded semiconductor package | Chau Fatt Chiang | 2020-10-06 |
| 10741466 | Formation of conductive connection tracks in package mold body using electroless plating | Cher Hau Danny Koh, Norliza Morban, Yong Chern Poh, Si Hao Vincent Yeo | 2020-08-11 |