Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741466 | Formation of conductive connection tracks in package mold body using electroless plating | Cher Hau Danny Koh, Norliza Morban, Khay Chwan Saw, Si Hao Vincent Yeo | 2020-08-11 |