Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10870575 | Stressed decoupled micro-electro-mechanical system sensor | Bernhard Knott, Thoralf Kautzsch, Mirko Vogt, Maik Stegemann, Andre Roeth +4 more | 2020-12-22 |
| 10802124 | Sonic sensors and packages | Klaus Elian | 2020-10-13 |
| 10781095 | Molded lead frame sensor package | Jochen Dangelmaier, Manfred Schindler, Mathias Vaupel | 2020-09-22 |
| 10782270 | Photoacoustic gas sensor package | Rainer Markus Schaller, Thomas Mueller | 2020-09-22 |
| 10753858 | Wafer arrangement | Stefan Kolb, Alfons Dehe, Jochen Huber, Franz Jost, Wilhelm Wiedmeier +1 more | 2020-08-25 |
| 10678046 | Packages for microelectromechanical system (MEMS) mirror and methods of manufacturing the same | Cyrus Ghahremani | 2020-06-09 |
| 10677675 | Pressure sensor module having a sensor chip and passive devices within a housing | Mathias Vaupel, Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt +1 more | 2020-06-09 |
| 10616703 | MEMS sound transducer element and method for producing a MEMS sound transducer element | Matthias Steiert | 2020-04-07 |
| 10566309 | Multi-purpose non-linear semiconductor package assembly line | Thorsten Meyer, Gerald Ofner, Peter Scherl, Stephan Bradl, Stefan Miethaner +1 more | 2020-02-18 |
| 10527589 | Apparatus and method for in-situ calibration of a photoacoustic sensor | Stefan Kolb, Alfons Dehe, Jochen Huber, Franz Jost, Juergen Woellenstein | 2020-01-07 |