Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10781095 | Molded lead frame sensor package | Jochen Dangelmaier, Manfred Schindler, Horst Theuss | 2020-09-22 |
| 10677675 | Pressure sensor module having a sensor chip and passive devices within a housing | Matthias Boehm, Steven Gross, Markus Loehndorf, Stephan Schmitt, Horst Theuss +1 more | 2020-06-09 |