Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10707158 | Package with vertical interconnect between carrier and clip | Alexander Heinrich, Bernd Goller, Thorsten Meyer | 2020-07-07 |
| 10566309 | Multi-purpose non-linear semiconductor package assembly line | Thorsten Meyer, Peter Scherl, Stephan Bradl, Stefan Miethaner, Alexander Heinrich +1 more | 2020-02-18 |