Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734352 | Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement | Irmgard Escher-Poeppel, Khalil Hosseini, Joachim Mahler, Thorsten Meyer, Georg Meyer-Berg +6 more | 2020-08-04 |
| 10571682 | Tilted chip assembly for optical devices | Ludwig Heitzer, Derek Debie, Klaus Elian, Cyrus Ghahremani, Oskar Neuhoff +1 more | 2020-02-25 |
| 10549985 | Semiconductor package with a through port for sensor applications | Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller +5 more | 2020-02-04 |