Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854547 | Chip package with cross-linked thermoplastic dielectric | Joachim Mahler, Guenter Tutsch | 2020-12-01 |
| 10734352 | Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement | Irmgard Escher-Poeppel, Khalil Hosseini, Johannes Lodermeyer, Joachim Mahler, Thorsten Meyer +6 more | 2020-08-04 |
| 10679959 | Semiconductor device | Christoph Kutter, Ewald Soutschek | 2020-06-09 |
| 10600690 | Method for handling a product substrate and a bonded substrate system | Claus von Waechter, Michael Bauer, Holger Doepke, Dominic Maier, Daniel Porwol +1 more | 2020-03-24 |
| 10529678 | Semiconductor device | Christoph Kutter, Ewald Soutschek | 2020-01-07 |