Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854547 | Chip package with cross-linked thermoplastic dielectric | Joachim Mahler, Georg Meyer-Berg | 2020-12-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854547 | Chip package with cross-linked thermoplastic dielectric | Joachim Mahler, Georg Meyer-Berg | 2020-12-01 |