Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854547 | Chip package with cross-linked thermoplastic dielectric | Georg Meyer-Berg, Guenter Tutsch | 2020-12-01 |
| 10832992 | Die attach methods and semiconductor devices manufactured based on such methods | Giovanni Ragasa Garbin, Chen Wen Lee, Benjamin Reichert, Peter Strobel | 2020-11-10 |
| 10734352 | Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement | Irmgard Escher-Poeppel, Khalil Hosseini, Johannes Lodermeyer, Thorsten Meyer, Georg Meyer-Berg +6 more | 2020-08-04 |
| 10670474 | Temperature sensor | Christian Kegler, Johannes Georg Laven, Hans-Joachim Schulze, Guenther Ruhl | 2020-06-02 |
| 10672678 | Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package | Heinrich Koerner, Michael Bauer, Reimund Engl, Michael Huettinger, Werner Kanert +1 more | 2020-06-02 |