Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672678 | Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package | Heinrich Koerner, Michael Bauer, Reimund Engl, Michael Huettinger, Joachim Mahler +1 more | 2020-06-02 |