Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672678 | Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package | Heinrich Koerner, Reimund Engl, Michael Huettinger, Werner Kanert, Joachim Mahler +1 more | 2020-06-02 |
| 10600690 | Method for handling a product substrate and a bonded substrate system | Georg Meyer-Berg, Claus von Waechter, Holger Doepke, Dominic Maier, Daniel Porwol +1 more | 2020-03-24 |
| 10565023 | Outage detection and compute resource protection in a computer service environment | Sharad Cornejo Altuzar, Pietro Verrecchia, Benjamin Byrnes, Victoria Svidenko, Donald McNamara +2 more | 2020-02-18 |