Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867893 | Semiconductor devices and methods for forming a semiconductor device | Sergey Ananiev, Robert Bauer, Yik Yee Tan, Juergen Walter | 2020-12-15 |
| 10672678 | Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package | Michael Bauer, Reimund Engl, Michael Huettinger, Werner Kanert, Joachim Mahler +1 more | 2020-06-02 |